Advanced Materials/Failure Analysis (AMFA) Workshop
April 20, 2007 • Phoenix, Arizona
AMFA MISSION:
To serve the interests of failure analysis & materials characterization professionals by providing a forum for the presentation and active discussion of timely and pertinent technological issues and trends and to promote the development of new capabilities that fill critical gaps in emerging technologies.
Unlike traditional conferences that often restrict audience participation, AMFA Workshops provide only top quality invited speakers on leading edge topics, in a format where audience participation is expected and strongly encouraged.
Preliminary Program
• FA Role: Dynamic Driver or Passive Passenger? Rich Blish, Spansion; Efrat Raz, Gemtech
• Leveraging Federal Funding for Characterization Tools, Bruce Gnade, University of Texas, Dallas
• Advances in Terahertz Imaging, Hamid Tizhoosh, University of Waterloo
• Metrology for Emerging Devices and Materials, Eric Vogel, University of Texas, Dallas
• ALIS Microscopy, Bill Ward, ALIS
• Materials Characterization Using Ultrafast Lasers, David Cahill, University of Illinois
• Failure Analysis Year In Review, Christian Boit, Berlin University of Technology
For general workshop information, visit http://www.amfaworkshop.org/ or contact:
Gay Samuelson
Workshop Chair, AMFA
Technical Consultant
Tel: (480) 707-2083
Email: g.m.samuelson@att.net
For registration and mailings
IRPS Publishing Services
P.O. Box 308
Westmoreland, NY 13490 USA
Tel: (315) 339-3968
Fax: (315) 336-9134
e-mail: pub_services@irps.org
The AMFA Workshop is technically cosponsored by the IEEE Reliability Society and the Electronic Device Failure Analysis Society.